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탄소섬유 복합재의 전극 감응형 네트워크를 통한 효율적인 손상 감지를 위한 광소결된 구리 나노잉크의 전도성 향상에 관한 연구A Study for Improvement of Electrical Conductivity of Flash Light Sintered Cu Nano-Ink for Damage Detection of Carbon Fiber-Reinforced Composite Via Addressable Conducting Network (ACN)

Other Titles
A Study for Improvement of Electrical Conductivity of Flash Light Sintered Cu Nano-Ink for Damage Detection of Carbon Fiber-Reinforced Composite Via Addressable Conducting Network (ACN)
Authors
Joo, Sung-JunYu, Myeong-HyeonKim, Hak-Sung
Issue Date
Dec-2017
Publisher
KOREAN SOC NONDESTRUCTIVE TESTING
Keywords
Carbon Fiber-Reinforced Composite; Addressable Conducting Network (ACN); Flash Light Sintering; Cu-Nano-Ink; Electrical Conductivity; Contact Resistance
Citation
JOURNAL OF THE KOREAN SOCIETY FOR NONDESTRUCTIVE TESTING, v.37, no.6, pp.387 - 392
Indexed
KCI
Journal Title
JOURNAL OF THE KOREAN SOCIETY FOR NONDESTRUCTIVE TESTING
Volume
37
Number
6
Start Page
387
End Page
392
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/18613
DOI
10.7779/JKSNT.2017.37.6.387
ISSN
1225-7842
Abstract
본 연구에서는 탄소섬유 복합재의 손상 감지를 위한 구리 나노 잉크의 제조 및 광소결을 수행하였다. 구리 나노 잉크의 조성물에 따른 소결 특성을 탐색하기 위해 고분자 바인더의 양을 변화시켜가며 잉크를 제조하였다. 제조된 구리 나노 잉크는 탄소섬유 복합재 상에 인쇄되었고, 인쇄된 구리 나노 잉크는 최적 광소결조건 탐색을 위해 다양한 조건으로 소결되었다. 또한, 광소결 시 구리 전극의 박리를 방지하기 위하여 실레인을 추가적으로 첨가하여 나노 잉크를 제조 및 광소결을 수행하였다. 그 결과, 탄소섬유 복합재 상에 박리 없이 10.1 μΩ·cm의 비저항을 갖는 높은 전기 전도도를 갖는 구리 전극을 성공적으로 제작하였다. 더욱이, 이는 구리 테이프를 이용했을 때보다 훨씬 낮은 탄소섬유 복합재와의 접촉 저항(1.3 Ω)을 가지는 것을 확인하였다. In this study, copper (Cu) nano-ink was fabricated and flash light sintered to detect the damage of carbon fiber-reinforced composite. In order to investigate the sintering characteristics, various Cu nano-inks were prepared according to the wt% of polymeric binder. The fabricated Cu nano-inks were printed on carbon fiber-reinforced composite, and flash light sintered under various conditions. Also, silane was added to Cu nano-ink to prevent delamination of Cu nano-ink during flash light sintering. As a result, an optimally fabricated Cu electrode was achieved with high electrical conductivity (10.1 mu Omega.cm) without damaging the carbon fiber-reinforced composite. Moreover, it was confirmed that the optimally fabricated Cu electrode had much lower contact resistance (1.3 Omega) with the carbon fiber-reinforced composite than the Cu tape.
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