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은/구리 하이브리드 잉크의 다층 회로기판에서의 적용을 위한 레올로지 및 광소결 특성에 관한 연구Study on rheological behavior and flash light sintering characteristics of Cu/Ag hybrid nano-ink for multi-layered printed circuit board
- Other Titles
- Study on rheological behavior and flash light sintering characteristics of Cu/Ag hybrid nano-ink for multi-layered printed circuit board
- Issue Date
- Nov-2017
- Publisher
- 대한기계학회
- Keywords
- printed electronics(인쇄 전자); flash light sintering(광소결); rheology (레올로지); Cu/Ag hybrid-ink (은/구리 하이브리드 잉크)
- Citation
- 대한기계학회 2017년도 학술대회, pp.1969 - 1970
- Indexed
- OTHER
- Journal Title
- 대한기계학회 2017년도 학술대회
- Start Page
- 1969
- End Page
- 1970
- Abstract
- In this work, rheological property and flash light sintering characteristic of Cu/Ag hybrid-ink were investigated for multi-layered printed circuit board application. Firstly, Cu/Ag hybrid-ink was fabricated with various composition of epoxy content, the fabricated Cu/Ag hybrid-inks were printed to the polyimide (PI) substrates to observe printing characteristics of pattern and via-hole area according to the rheological property of ink. Then, the printed Cu/Ag hybrid-inks were sintered with various flash light sintering condition to observe flash light sintering characteristics. As a result, the optimally fabricated ink showed good printability of pattern and via-hole area, and optimized multi-pulse flash light sintering case exhibited low resistance (0.18 Ohm/cm) and high adhesion strength (5B).
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Collections - 서울 공과대학 > 서울 기계공학부 > 1. Journal Articles
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)