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무선 웨어러블 기기를 위한 신축성 RF 전자소자 및 패기징 기술

Authors
정예환
Issue Date
6-Apr-2023
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/186468
Place
수원컨벤션센터 4F
Conference Name
2023년 정기학술대회 한국마이크로전자 및 패키징학회
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서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers

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Jung, Yei Hwan
COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)
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