Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Control of electroplated copper layers for RDL fabrication on PCB substrates
- Authors
- 소홍윤
- Issue Date
- 4-Apr-2023
- Place
- The PLAZA Seoul, Seoul
- Conference Name
- ROK-USA Forum on Nanotechnology
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)