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Comparison of electroplated copper patterns in RDL fabrication on wafer and PCB substrates
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 소홍윤 | - |
| dc.date.accessioned | 2023-07-05T05:31:49Z | - |
| dc.date.available | 2023-07-05T05:31:49Z | - |
| dc.date.created | 2023-07-01 | - |
| dc.date.issued | 2023-04-06 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/186585 | - |
| dc.publisher | 한국마이크로전자 및 패키징학회 (KMEPS) | - |
| dc.title | Comparison of electroplated copper patterns in RDL fabrication on wafer and PCB substrates | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 소홍윤 | - |
| dc.identifier.bibliographicCitation | 한국마이크로전자 및 패키징학회 (KMEPS) 정기학술대회 | - |
| dc.relation.isPartOf | 한국마이크로전자 및 패키징학회 (KMEPS) 정기학술대회 | - |
| dc.citation.title | 한국마이크로전자 및 패키징학회 (KMEPS) 정기학술대회 | - |
| dc.citation.conferencePlace | 수원컨벤션센터 | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 2 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)