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Comparison of electroplated copper patterns in RDL fabrication on wafer and PCB substrates
- Authors
- 소홍윤
- Issue Date
- 6-Apr-2023
- Publisher
- 한국마이크로전자 및 패키징학회 (KMEPS)
- Citation
- 한국마이크로전자 및 패키징학회 (KMEPS) 정기학술대회
- Conference Name
- 한국마이크로전자 및 패키징학회 (KMEPS) 정기학술대회
- Place
- 수원컨벤션센터
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)