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Effect of Cu Addition on Magnetic Properties and Microstructures of SmFe 11 Ti Alloys Prepared by Melt-Spinning

Authors
김종렬
Issue Date
18-May-2023
Publisher
IEEE Magnetics
Citation
INTERMAG_23
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/188099
Conference Name
INTERMAG_23
Place
Sendai, Japan
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