Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations

Full metadata record
DC Field Value Language
dc.contributor.authorJang, Yongrae-
dc.contributor.authorYang, Yu-Hsiang-
dc.contributor.authorHan, Bongtae-
dc.contributor.authorKim, You-Gwon-
dc.contributor.authorKim, Hak-Sung-
dc.date.accessioned2023-09-04T05:34:20Z-
dc.date.available2023-09-04T05:34:20Z-
dc.date.created2023-08-29-
dc.date.issued2023-05-
dc.identifier.issn0569-5503-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/189617-
dc.description.abstractReliability of SAC-LTS hybrid joints is assessed. Two tasks are conducted to achieve the goal. The first task involves determination of the Bi concentration dependent constitutive properties. A simple solder assembly is fabricated to examine the distribution of Bi concentration within a hybrid solder joint. Based on the distribution results, specimens with known Bi concentrations are fabricated and tested at various temperatures to obtain the constants of the Anand model as a function of Bi concentration. In the second task, an FEM model is developed to simulate various layers with different Bi concentrations in the hybrid joint. The well-known energy-based fatigue model is implemented to predict the cycles to failure. The prediction is compared with actual thermal shock testing data, and the results are discussed.-
dc.language영어-
dc.language.isoen-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleLife-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations-
dc.typeArticle-
dc.contributor.affiliatedAuthorKim, Hak-Sung-
dc.identifier.doi10.1109/ECTC51909.2023.00343-
dc.identifier.scopusid2-s2.0-85168315543-
dc.identifier.wosid001047624100330-
dc.identifier.bibliographicCitationProceedings - Electronic Components and Technology Conference, v.2023-May, pp.2001 - 2006-
dc.relation.isPartOfProceedings - Electronic Components and Technology Conference-
dc.citation.titleProceedings - Electronic Components and Technology Conference-
dc.citation.volume2023-May-
dc.citation.startPage2001-
dc.citation.endPage2006-
dc.type.rimsART-
dc.type.docTypeProceedings Paper-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusBismuth-
dc.subject.keywordPlusElectronics packaging-
dc.subject.keywordPlusForecasting-
dc.subject.keywordPlusShock testing-
dc.subject.keywordPlusSoldering-
dc.subject.keywordPlusThermal shock-
dc.subject.keywordPlusBi-based-
dc.subject.keywordPlusBismuth diffusion-
dc.subject.keywordPlusConcentration-dependent-
dc.subject.keywordPlusDiffused layers-
dc.subject.keywordPlusHybrid joints-
dc.subject.keywordPlusHybrid solder joint-
dc.subject.keywordPlusLife predictions-
dc.subject.keywordPlusSolder joints-
dc.subject.keywordPlusSolder reliability-
dc.subject.keywordPlusThermal shock tests-
dc.subject.keywordAuthorbismuth diffusion-
dc.subject.keywordAuthorhybrid solder joint-
dc.subject.keywordAuthorlife-prediction-
dc.subject.keywordAuthorsolder reliability-
dc.subject.keywordAuthorthermal shock test-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/10195828-
Files in This Item
Go to Link
Appears in
Collections
서울 공과대학 > 서울 기계공학부 > 1. Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher Kim, Hak Sung photo

Kim, Hak Sung
COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
Read more

Altmetrics

Total Views & Downloads

BROWSE