Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, Yongrae | - |
dc.contributor.author | Yang, Yu-Hsiang | - |
dc.contributor.author | Han, Bongtae | - |
dc.contributor.author | Kim, You-Gwon | - |
dc.contributor.author | Kim, Hak-Sung | - |
dc.date.accessioned | 2023-09-04T05:34:20Z | - |
dc.date.available | 2023-09-04T05:34:20Z | - |
dc.date.created | 2023-08-29 | - |
dc.date.issued | 2023-05 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/189617 | - |
dc.description.abstract | Reliability of SAC-LTS hybrid joints is assessed. Two tasks are conducted to achieve the goal. The first task involves determination of the Bi concentration dependent constitutive properties. A simple solder assembly is fabricated to examine the distribution of Bi concentration within a hybrid solder joint. Based on the distribution results, specimens with known Bi concentrations are fabricated and tested at various temperatures to obtain the constants of the Anand model as a function of Bi concentration. In the second task, an FEM model is developed to simulate various layers with different Bi concentrations in the hybrid joint. The well-known energy-based fatigue model is implemented to predict the cycles to failure. The prediction is compared with actual thermal shock testing data, and the results are discussed. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Hak-Sung | - |
dc.identifier.doi | 10.1109/ECTC51909.2023.00343 | - |
dc.identifier.scopusid | 2-s2.0-85168315543 | - |
dc.identifier.wosid | 001047624100330 | - |
dc.identifier.bibliographicCitation | Proceedings - Electronic Components and Technology Conference, v.2023-May, pp.2001 - 2006 | - |
dc.relation.isPartOf | Proceedings - Electronic Components and Technology Conference | - |
dc.citation.title | Proceedings - Electronic Components and Technology Conference | - |
dc.citation.volume | 2023-May | - |
dc.citation.startPage | 2001 | - |
dc.citation.endPage | 2006 | - |
dc.type.rims | ART | - |
dc.type.docType | Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.subject.keywordPlus | Bismuth | - |
dc.subject.keywordPlus | Electronics packaging | - |
dc.subject.keywordPlus | Forecasting | - |
dc.subject.keywordPlus | Shock testing | - |
dc.subject.keywordPlus | Soldering | - |
dc.subject.keywordPlus | Thermal shock | - |
dc.subject.keywordPlus | Bi-based | - |
dc.subject.keywordPlus | Bismuth diffusion | - |
dc.subject.keywordPlus | Concentration-dependent | - |
dc.subject.keywordPlus | Diffused layers | - |
dc.subject.keywordPlus | Hybrid joints | - |
dc.subject.keywordPlus | Hybrid solder joint | - |
dc.subject.keywordPlus | Life predictions | - |
dc.subject.keywordPlus | Solder joints | - |
dc.subject.keywordPlus | Solder reliability | - |
dc.subject.keywordPlus | Thermal shock tests | - |
dc.subject.keywordAuthor | bismuth diffusion | - |
dc.subject.keywordAuthor | hybrid solder joint | - |
dc.subject.keywordAuthor | life-prediction | - |
dc.subject.keywordAuthor | solder reliability | - |
dc.subject.keywordAuthor | thermal shock test | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/10195828 | - |
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