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Design and Simulation of a Microwave Plasma Enhanced Chemical Vapor Deposition System Using Multiphysics Fluid Modeling
- Authors
- Ming-Chieh Lin
- Issue Date
- 23-May-2023
- Publisher
- The Plasma Science and Application Committee (PSAC) of the IEEE Nuclear and Plasma Sciences Society (NPSS)
- Citation
- The 50th IEEE International Conference on Plasma Science (ICOPS)
- Conference Name
- The 50th IEEE International Conference on Plasma Science (ICOPS)
- Place
- Santa Fe, New Mexico, USA
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Collections - 서울 공과대학 > 서울 전기공학전공 > 2. Conference Papers
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Related Researcher
- Lin, Ming Chieh
- COLLEGE OF ENGINEERING (MAJOR IN ELECTRICAL ENGINEERING)