Fabrication and evaluation of capacitive silicon resonators with piezoresistive heat engines

Abstract

This work reports the design, fabrication and evaluation of capacitive silicon resonators with piezoresistive heat engines. A combination of capacitive transduction and piezoresistive actuation based on a piezoresistive heat engine in the single micromechanical resonator is proposed to achieve a low insertion loss and small motional resistance. Capacitive silicon resonators with single and multiple piezoresistive beams have been demonstrated. In these structures, resonant bodies are divided into many parts that are connected to each other by using small piezoresistive beams to enhance electromechanical transductions by the piezoresistive heat engines. When a bias voltage V-b = 7 V is applied to the piezoresistive beams, the insertion loss and motional resistance of the capacitive silicon resonator with multiple piezoresistive beams are improved by 20 dB (enhanced from -68 dB to -48 dB) and 90% (reduced from 125.5 k Omega to 12.5 k Omega), respectively, in comparison to the case without a bias voltage. In addition, the tuning frequency characteristic with the piezoresistive effect is increased by 165 times over that of the structure with only the capacitive effect.