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Analysis of Grounded Coplanar Waveguide (GCPW) for High-Speed Links Channel

Authors
Oh, YoungminSim, TaeyangHan, Jaeduk
Issue Date
Oct-2023
Publisher
Institute of Electrical and Electronics Engineers Inc.
Keywords
Channel; GCPW; impedance matching; insertion loss; via
Citation
Proceedings - International SoC Design Conference 2023, ISOCC 2023, pp 117 - 118
Pages
2
Indexed
SCOPUS
Journal Title
Proceedings - International SoC Design Conference 2023, ISOCC 2023
Start Page
117
End Page
118
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/196666
DOI
10.1109/ISOCC59558.2023.10396166
ISSN
0000-0000
Abstract
This paper presents an analysis of a Grounded coplanar waveguide (GCPW) channel for high-speed links. GCPW channels are fabricated using Rogers-4003C material with a thickness of 0.2T and signal line length of 100mm, suitable for high-speed links. The insertion loss and impedance matching characteristics were improved by reducing the spacing between vias, larger via size, and narrowing the gap between the signal line and vias.
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