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Study on the mechanical behavior of epoxy molding compound under various curing conditions using fiber Bragg grating sensor and dielectric sensor
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2024-12-04T11:30:25Z | - |
| dc.date.available | 2024-12-04T11:30:25Z | - |
| dc.date.issued | 2023-11-21 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/199993 | - |
| dc.title | Study on the mechanical behavior of epoxy molding compound under various curing conditions using fiber Bragg grating sensor and dielectric sensor | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | KISM 2023 | - |
| dc.citation.conferencePlace | Paradise Hotel Busan (Haeundae Beach), Busan, Korea | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)