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Prediction of crack type and life of printed circuit board under thermal cycling with respect to solder composition
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2024-12-04T11:30:25Z | - |
| dc.date.available | 2024-12-04T11:30:25Z | - |
| dc.date.issued | 2023-03-09 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/199999 | - |
| dc.title | Prediction of crack type and life of printed circuit board under thermal cycling with respect to solder composition | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | IEEE EDTM 2023 | - |
| dc.citation.conferencePlace | COEX, SEOUL, KOREA | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)