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반도체 패키지 발열 예측을 위한 멀티 스케일 전산 해석 연구
- Authors
- 김동립
- Issue Date
- 26-Apr-2024
- Place
- 라마다프라자 제주호텔
- Conference Name
- 대한기계학회 열공학부문 2024년 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Dong Rip
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)