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RDL 공정에서의 기판이 Cu trace에 미치는 영향 분석
- Authors
- 소홍윤
- Issue Date
- 22-Mar-2024
- Place
- 여수 소노캄
- Conference Name
- 대한기계학회 신뢰성부문 2024년 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)