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Measurement of the Interfacial Strength of Thin Metal Film by Laser Spallation Method for Advanced Wafer Level Package
- Authors
- 이승환
- Issue Date
- 31-May-2024
- Place
- Gaylord Rockies Resort & Convention Center Denver
- Conference Name
- The 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)