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Laser Spallation Test for Measurement of the Interfacial Adhesion of Thin Films
- Authors
- 이승환
- Issue Date
- 25-Oct-2023
- Place
- 파라다이스 호텔 부산
- Conference Name
- The 21st International Symposium on Microelectronics and Packaging (ISMP)
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Lee, Seung Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)