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Apparatus for electronic component disassembly from printed circuit board assembly in e-wastes
- Authors
- Park, Seungsoo; Kim, Seongmin; Han, Yosep; Park, Jai Koo
- Issue Date
- Nov-2015
- Publisher
- Elsevier BV
- Keywords
- Printed circuit board assembly; Electronic components; Disassembly process; Recycling; E-wastes
- Citation
- International Journal of Mineral Processing, v.144, pp 11 - 15
- Pages
- 5
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- International Journal of Mineral Processing
- Volume
- 144
- Start Page
- 11
- End Page
- 15
- ISSN
- 0301-7516
1879-3525
- Abstract
- The current study involves the development of an electronic component (EC) disassembly apparatus for printed circuit board assembly (PCBA) in the pretreatment processing of electronic waste recycling. In the apparatus, the PCBA is fed slowly into the disassembly module and is then heated via infra-red heater over the melting point of the solder which bonds the PCB and ECs. The ECs are swept off from the PCB with the use of rotating steel brush rods. Then, the ECs on both sides of the boards are removed simultaneously. The maximum disassembly ratio (94%) is obtained at a feeding speed of 0.33 cm/s and a heating temperature of 250 degrees C.
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Collections - 서울 공과대학 > 서울 자원환경공학과 > 1. Journal Articles
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