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Influence of bacterial adhesion on copper extraction from printed circuit boards

Authors
Silva, Rene A.Park, JeonghyunLee, EunseongPark, Jai KooChoi, Siyoung Q.Kim, Hyunjung
Issue Date
Mar-2015
Publisher
Pergamon Press Ltd.
Keywords
Printed circuit boards; Bioleaching; Copper extraction; Bacterial adhesion
Citation
Separation and Purification Technology, v.143, pp 169 - 176
Pages
8
Indexed
SCIE
SCOPUS
Journal Title
Separation and Purification Technology
Volume
143
Start Page
169
End Page
176
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/202669
DOI
10.1016/j.seppur.2015.01.038
ISSN
1383-5866
1873-3794
Abstract
In order to analyze the influence of the contact mechanism in the bioleaching process, bacterial attachment on the Printed Circuit Boards (PCB) surface was avoided using a partition system. The partition system was obtained with a semi-permeable membrane of 12-14 kDa MWCO. A PCB sample of 500-1000 mu m particle size was placed inside a partition system for 144 h to compare the copper (Cu) extraction rate by Acidithiobacillus ferrooxidans, with the Cu extraction of a system without partition. The results demonstrated that when the contact mechanism was avoided, there was a decrease of 25% in the Cu extraction. When the contact bioleaching was enabled, 1.46 g of Cu was extracted from the initial 1.61 g of Cu (similar to 91% extraction). When the partition system was used, only 1.10 g of Cu was extracted (similar to 68% extraction). Bacterial adhesion experiments proved that within the first hour of the experiment, 4.30 x 10(7) cells were attached per gram of PCB, supporting that bacterial adhesion was responsible for the higher Cu extraction rate. The results for bacterial adhesion tests were consistent with Derjaguin-Landau-Verwey-Overbeek theory.
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