Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders
- Authors
- Kim, Tae Jin; Kim, Young Min; Kim, Young-Ho
- Issue Date
- Sep-2012
- Publisher
- Elsevier BV
- Keywords
- Pb-free solders; Ni-Zn; Under bump metallization; Interfacial reactions; Microstructure
- Citation
- Journal of Alloys and Compounds, v.535, pp 33 - 38
- Pages
- 6
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- Journal of Alloys and Compounds
- Volume
- 535
- Start Page
- 33
- End Page
- 38
- ISSN
- 0925-8388
1873-4669
- Abstract
- We developed a new sputtered under bump metallurgy (UBM) based on Ni-20wt% Zn thin films for Pb-free solders. This study focuses on the interfacial reactions between two Pb-free solders (Sn3.0Ag0.5Cu and Sn1.0Ag0.7Cu) and a Ni-Zn alloy UBM. By adding Zn to Ni UBM, Zn is incorporated into intermetallic compounds (IMCs) to form a quaternary Cu-Ni-Zn-Sn phase at the solder/Ni-Zn interface after reflow and subsequent isothermal aging. The Ni-Zn UBM sufficiently reduces the interfacial reaction and IMCs formation rates as well as UBM consumption rates compared to a Ni UBM. In particular, the formation of (Ni, Cu)(3)Sn-4 IMC was significantly retarded by adding Zn into UBM.
- Files in This Item
- Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.