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전기도금 전류밀도에 따른 Cu grain 크기 및 wet etch rate에 관한 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2025-01-08T12:30:33Z | - |
| dc.date.available | 2025-01-08T12:30:33Z | - |
| dc.date.issued | 2024-04-03 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/204983 | - |
| dc.title | 전기도금 전류밀도에 따른 Cu grain 크기 및 wet etch rate에 관한 연구 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 2024년 (사)한국마이크로전자 및 패키징학회(KMEPS) 정기학술대회 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)