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Simulation benchmarks of the PIC-MCC codes XPDP1 and VSim for capacitively coupled plasma helium and argon discharges
- Authors
- Ming-Chieh Lin
- Issue Date
- 18-Jun-2024
- Place
- Beijing, China
- Conference Name
- The 51st IEEE International Conference on Plasma Science (ICOPS)
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Collections - 서울 공과대학 > 서울 전기공학전공 > 2. Conference Papers
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Related Researcher
- Lin, Ming Chieh
- COLLEGE OF ENGINEERING (MAJOR IN ELECTRICAL ENGINEERING)