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형상 변형이 가능한 PVA 기반 스탬프를 이용한 3D 전사 인쇄 기술 (3D Transfer printing technology using shape deformable PVA-based stamp)
- Authors
- 정예환
- Issue Date
- 3-Apr-2024
- Place
- 국립아시아문화전당 ((61485) 광주광역시 동구 문화전당로 38)
- Conference Name
- 한국마이크로전자 및 패키징학회 2024년 정기학술대회(KMEPS)
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Jung, Yei Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)