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Impact of TSV Configuration on Thermal Performance of High Bandwidth Memory
- Authors
- 임재명
- Issue Date
- 7-Nov-2024
- Conference Name
- International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Lim, Jaemyung
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)