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Design Methodology for Low-Voltage Operational (≤1 V) FRAM Cell Capacitors and Approaches for Overcoming Disturb Issues in 1T-nC Arrays: Experimental & Modeling

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dc.contributor.authorLee, Sangho-
dc.contributor.authorKim, Giuk-
dc.contributor.authorKim, Chaeheon-
dc.contributor.authorJung, Yangjin-
dc.contributor.authorHwang, Jeonghyun-
dc.contributor.authorNam, Yunseok-
dc.contributor.authorShin, Mincheol-
dc.contributor.authorGoh, Youngin-
dc.contributor.authorRyu, Mintae-
dc.contributor.authorSuh, Jihye-
dc.contributor.authorLee, Kilho-
dc.contributor.authorKim, Wanki-
dc.contributor.authorHa, Daewon-
dc.contributor.authorAhn, Jinho-
dc.contributor.authorJeon, Sanghun-
dc.date.accessioned2025-04-08T08:00:12Z-
dc.date.available2025-04-08T08:00:12Z-
dc.date.issued2025-02-
dc.identifier.issn0163-1918-
dc.identifier.issn2156-017X-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/206991-
dc.description.abstractIn this work, we provide a methodology for designing an anti-ferroelectric (AFE) based FRAM cell capacitor that operates at low voltage (≤ 1 V), while achieving superior high and steep polarization (∆P) switching characteristics (23.5 μC/cm2), considering BEOL compatibility (process temp. ≤ 400 ℃). Furthermore, through experimental demonstration and modeling, we validate that the steep ∆P switching, closely related to the domain size of the AFE material, is a key enabler for mitigating disturbance issues in 1T-nC FRAM arrays. Our reliable model framework, calibrated with physical and structural parameters, determines the optimal number of stacks for the 3D 1T-nC FRAM architecture from the perspective of disturbance characteristics. This work highlights the potential of hafnia-based materials in embedded cache memory, bridging the gap between Δ P functionality and reliability.-
dc.format.extent4-
dc.language영어-
dc.language.isoENG-
dc.titleDesign Methodology for Low-Voltage Operational (≤1 V) FRAM Cell Capacitors and Approaches for Overcoming Disturb Issues in 1T-nC Arrays: Experimental & Modeling-
dc.typeArticle-
dc.identifier.doi10.1109/IEDM50854.2024.10873568-
dc.identifier.scopusid2-s2.0-86000016770-
dc.identifier.bibliographicCitationTechnical Digest - International Electron Devices Meeting, pp 1 - 4-
dc.citation.titleTechnical Digest - International Electron Devices Meeting-
dc.citation.startPage1-
dc.citation.endPage4-
dc.type.docTypeConference paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordPlusCapacitor bank-
dc.subject.keywordPlusCellular arrays-
dc.subject.keywordPlusFerroelectric materials-
dc.subject.keywordPlusIntegrated circuit design-
dc.subject.keywordPlusMOS capacitors-
dc.subject.keywordPlusZero voltage switching-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/10873568-
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