A review in thermal management for advanced chip packaging from chip to heat sink

Abstract

As the architectural complexity of semiconductor devices increases, energy-efficient thermal management in semiconductor packages has become a significant challenge. The effectiveness of thermal management dictates the performance and reliability of semiconductor packaging, making it a crucial factor in the design of highperformance and high-density systems. This review provides a detailed overview of recent advances in thermal management solutions for semiconductor packages, with a particular focus on heat conduction from the chip to the heat sink. The review first introduces advanced thermal characterization techniques, which are essential for evaluating the passive thermal performance of chip packages. It then explores the use of high thermal conductivity materials in various components, such as thermal interface materials (TIMs), heat spreaders, and package substrates, all of which are critical for improving heat dissipation. Additionally, the review examines design aspects aimed at enhancing heat removal rates, including interface engineering between dissimilar components and the incorporation of thermal vias within a package. The aforementioned approaches can be combined to optimize overall thermal performance in semiconductor packages, requiring careful material selection and appropriate thermal engineering design.