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Stabilization of Morphotropic Phase Boundary in Hafnia via Microwave Low-Temperature Crystallization Process for Next-Generation Dynamic Random Access Memory Technology

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dc.contributor.authorShin, Hunbeom-
dc.contributor.authorKim, Giuk-
dc.contributor.authorLee, Sujeong-
dc.contributor.authorChoi, Hyojun-
dc.contributor.authorLee, Sangho-
dc.contributor.authorLee, Sangmok-
dc.contributor.authorNam, Yunseok-
dc.contributor.authorKang, Geonhyeong-
dc.contributor.authorKim, Hyungjun-
dc.contributor.authorAhn, Jinho-
dc.contributor.authorJeon, Sanghun-
dc.date.accessioned2025-06-25T07:30:23Z-
dc.date.available2025-06-25T07:30:23Z-
dc.date.issued2024-09-
dc.identifier.issn1862-6254-
dc.identifier.issn1862-6270-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/207907-
dc.description.abstractThe morphotropic phase boundary (MPB), which arises from the combination of antiferroelectric and ferroelectric phases, demonstrates the highest dielectric constant (κ) compared to other phases. This emphasizes its potential as a leading contender for dielectric films in future dynamic random access memory (DRAM) capacitors. MPB-based high-κ materials using hafnia have shown a trade-off between equivalent oxide thickness (EOT) and leakage current density (Jleak) when the crystallization temperature increases with scaling the thickness. Herein, a microwave annealing (MWA) method that can achieve low-temperature crystallization below 350 °C is employed. The purpose of this method is to mitigate the trade-off relationships and achieve the strict criteria of current DRAM capacitors. These criteria include low EOT (less than 4 Å) and Jleak (less than 10−7 A cm−2 at 0.8 V) characteristics. The MWA is capable of relatively low-temperature annealing by supplying energy to the films through both thermal energy and dipole vibration energy. As a result, a record-low EOT of 3.76 Å and a low leakage current characteristic of 4.2 × 10−8 A cm−2 at 0.8 V are achieved concurrently. It is confident that the research can be important in addressing the challenges associated with reducing the size of next-generation DRAM capacitors.-
dc.format.extent7-
dc.language영어-
dc.language.isoENG-
dc.publisherWiley - VCH Verlag GmbH & CO. KGaA-
dc.titleStabilization of Morphotropic Phase Boundary in Hafnia via Microwave Low-Temperature Crystallization Process for Next-Generation Dynamic Random Access Memory Technology-
dc.typeArticle-
dc.publisher.location독일-
dc.identifier.doi10.1002/pssr.202400108-
dc.identifier.scopusid2-s2.0-85193587196-
dc.identifier.wosid001228106000001-
dc.identifier.bibliographicCitationphysica status solidi (RRL) - Rapid Research Letters, v.18, no.9, pp 1 - 7-
dc.citation.titlephysica status solidi (RRL) - Rapid Research Letters-
dc.citation.volume18-
dc.citation.number9-
dc.citation.startPage1-
dc.citation.endPage7-
dc.type.docTypeArticle; Early Access-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusEQUIVALENT OXIDE THICKNESS-
dc.subject.keywordPlusHFXZR1-XO2-
dc.subject.keywordPlusACHIEVE-
dc.subject.keywordPlusLAYERS-
dc.subject.keywordPlusFILMS-
dc.subject.keywordPlusNM-
dc.subject.keywordAuthorDRAM technology-
dc.subject.keywordAuthorHfO2-
dc.subject.keywordAuthorlow equivalent oxide thickness-
dc.subject.keywordAuthorlow leakage current-
dc.subject.keywordAuthormorphotropic phase boundary-
dc.identifier.urlhttps://onlinelibrary.wiley.com/doi/10.1002/pssr.202400108-
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