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Designing Robust Interfaces of HZO Module (>1012 at 85 °c) with High Sensing Margin (>300 mV) for ≤1.1 V 1T-1F with Common Plate Line and 1T-nF FeRAM

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dc.contributor.authorJeon, Intak-
dc.contributor.authorLim, Hanjin-
dc.contributor.authorKim, Seon-yong-
dc.contributor.authorKim, Jin-soak-
dc.contributor.authorAhn, Sehyoung-
dc.contributor.authorJung, Changhwa-
dc.contributor.authorKwon, Daewoong-
dc.contributor.authorKwon, Hyucknam-
dc.contributor.authorPark, Sung-Wook-
dc.date.accessioned2025-09-11T05:30:23Z-
dc.date.available2025-09-11T05:30:23Z-
dc.date.issued2025-07-
dc.identifier.issn0743-1562-
dc.identifier.issn2158-9682-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/208720-
dc.description.abstractEnergy-efficient AI will be realized in conjunction with ferroelectric nT-mF in the near future. First, we present a ferroelectric module solution that is equipped with Pr-boosted HZO (2Pr 54 μ C/cm2) and universally improved ILs for FE, MPB and AFE. The films show high write/read endurance cycles (> 1012 at 85 °C). Second, we implement the solution into 1T-1F with a common plate line and 1T-nF FeRAM. We confirm sufficiently high sensing margins (≥300 mV).-
dc.format.extent3-
dc.language영어-
dc.language.isoENG-
dc.titleDesigning Robust Interfaces of HZO Module (>1012 at 85 °c) with High Sensing Margin (>300 mV) for ≤1.1 V 1T-1F with Common Plate Line and 1T-nF FeRAM-
dc.typeArticle-
dc.identifier.doi10.23919/VLSITechnologyandCir65189.2025.11075096-
dc.identifier.scopusid2-s2.0-105012220104-
dc.identifier.bibliographicCitationDigest of Technical Papers - Symposium on VLSI Technology, pp 1 - 3-
dc.citation.titleDigest of Technical Papers - Symposium on VLSI Technology-
dc.citation.startPage1-
dc.citation.endPage3-
dc.type.docTypeConference paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordAuthorCommon plate line-
dc.subject.keywordAuthor1T-1F-
dc.subject.keywordAuthor1T-nF-
dc.subject.keywordAuthorHZO-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/11075096-
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