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Stress-Relief Island Design of Island-Bridge Structured InZnO TFT for Form-Free Display Applications Using Spatial ALD

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dc.contributor.authorLee, Won-Bum-
dc.contributor.authorKim, Min-Seo-
dc.contributor.authorLee, Chi-Hoon-
dc.contributor.authorLim, Jun Hyung-
dc.contributor.authorPark, Jin-Seong-
dc.date.accessioned2026-02-04T02:31:34Z-
dc.date.available2026-02-04T02:31:34Z-
dc.date.issued2025-07-
dc.identifier.issn2637-6113-
dc.identifier.issn2637-6113-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/210704-
dc.description.abstractThe increasing popularity of flexible and wearable electronics has created demand for robust and stretchable display technologies. However, maintaining active-matrix organic light-emitting diode functionality under mechanical deformation presents significant challenges. This study proposes an advanced island-bridge structural design for oxide thin-film transistors fabricated using atmospheric-pressure spatial atomic layer deposition. The proposed design includes square, circular, and patterned islands (4, 8, 12, and 16 patterns), with stress-relief properties validated through ANSYS simulations. Circular and patterned islands demonstrate superior stress distributions compared to conventional square designs, reducing stress concentrations by as much as 20%. In addition, the patterned island-bridge structures maintain their electrical performance under 30% strain, surpassing the performance of square and circular configurations. A 2-series thin-film transistor (TFT) fabricated using the proposed structure exhibits stable operation under 30% strain, highlighting its potential for practical applications in stretchable displays. This study paves the way for the integration of durable and high-performance stretchable electronics with advanced island-bridge designs.-
dc.format.extent9-
dc.language영어-
dc.language.isoENG-
dc.publisherAMER CHEMICAL SOC-
dc.titleStress-Relief Island Design of Island-Bridge Structured InZnO TFT for Form-Free Display Applications Using Spatial ALD-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1021/acsaelm.5c01035-
dc.identifier.scopusid2-s2.0-105009622563-
dc.identifier.wosid001522330400001-
dc.identifier.bibliographicCitationACS APPLIED ELECTRONIC MATERIALS, v.7, no.14, pp 6680 - 6688-
dc.citation.titleACS APPLIED ELECTRONIC MATERIALS-
dc.citation.volume7-
dc.citation.number14-
dc.citation.startPage6680-
dc.citation.endPage6688-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusPOLYMER-
dc.subject.keywordAuthorthin film transistor-
dc.subject.keywordAuthoratmosphere pressure spatial-atomiclayer deposition (AP S-ALD)-
dc.subject.keywordAuthorANSYS simulation-
dc.subject.keywordAuthorisland-bridge-
dc.subject.keywordAuthorstretchable display-
dc.identifier.urlhttps://pubs.acs.org/doi/10.1021/acsaelm.5c01035-
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