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Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2026-06-23T19:35:07Z | - |
| dc.date.available | 2026-06-23T19:35:07Z | - |
| dc.date.issued | 2025-11-07 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/214749 | - |
| dc.title | Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The 23rd International Symposium on Microelectronics and Packaging | - |
| dc.citation.conferencePlace | 바르미 호텔 인터불고, 대구 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)