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테라헤르츠파를 사용한 반도체 패키지 내부 칩 정렬 비파괴 검사 기술에 관한 연구
- Authors
- 김학성
- Issue Date
- 12-Nov-2025
- Place
- 전북대학교 국제컨벤션센터
- Conference Name
- 2025 한국비파괴검사학회 추계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)