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Study on Through-Glass Via (TGV) Filling Using Bimodal Copper Ink and Impact on Electrical Reliability
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2026-06-23T20:00:19Z | - |
| dc.date.available | 2026-06-23T20:00:19Z | - |
| dc.date.issued | 2025-06-27 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/214770 | - |
| dc.title | Study on Through-Glass Via (TGV) Filling Using Bimodal Copper Ink and Impact on Electrical Reliability | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 대한기계학회 재료 및 파괴부문 2025년 춘계학술대회 | - |
| dc.citation.conferencePlace | 서귀포 칼호텔, 제주 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)