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Dual-Salt Multi-Stimuli Hydrogel for Soft Electronic Applications

Authors
소홍윤
Issue Date
15-Jun-2025
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/215832
Place
ICC Jeju, South Korea
Conference Name
The 3rd Global Conference of Innovation Materials
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서울 공과대학 > 서울 기계공학부 > 2. Conference Papers

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COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)
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