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반도체 패키징 열해석 정확도 향상을 위한 열물성 해석
- Authors
- 소홍윤
- Issue Date
- 25-Jun-2025
- Place
- 제주 서귀포 KAL 호텔
- Conference Name
- 재료 및 파괴부문 2025년 춘계학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- So, Hong yun
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)