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Vertically Stacked Flexible Interposer by Transfer Printing for Manufacturing Heterogeneous 3D Integration Circuits
- Authors
- 정예환
- Issue Date
- 22-Aug-2025
- Place
- 대한민국 강원도 평창군 알펜시아 리조트
- Conference Name
- 2025 한국전자파학회 하계종합학술대회
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Jung, Yei Hwan
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)