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Analysis of the substrate effect on electrical characteristics of channels for 2.5D packaging using glass interposers
- Authors
- 임재명
- Issue Date
- 12-Feb-2025
- Conference Name
- 한국반도체 학술대회
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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Related Researcher
- Lim, Jaemyung
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)