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A Coalesced Tensor Reduction Architecture for Scalable All-Bank PIM Execution
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Taehyung | - |
| dc.contributor.author | Lee, Hyuk-Jae | - |
| dc.contributor.author | Rhee, Chae Eun | - |
| dc.date.accessioned | 2026-07-10T07:30:35Z | - |
| dc.date.available | 2026-07-10T07:30:35Z | - |
| dc.date.issued | 2026-06 | - |
| dc.identifier.issn | 2156-3357 | - |
| dc.identifier.issn | 2156-3365 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/219059 | - |
| dc.description.abstract | The embedding layer in deep learning recommendation models (DLRM) is highly memory-bound and exhibits skewed, irregular access patterns. These characteristics lead to severe load imbalance and performance bottlenecks in processing in memory (PIM) architectures. We propose TRAM (Two-level Reduction Accelerator for Memory), a heterogeneous accelerator that integrates High Bandwidth Memory based PIM architecture (HBM-PIM) with conventional dual in-line memory modules (DIMMs) to accelerate batched embedding vector reductions. TRAM reduces redundant hot-vector accesses and employs a host-side scheduling mechanism that overlaps bank-PIM operations inside DRAM banks with logic-PIM operations, where processing units are located in the buffer die. This overlap eliminates command-bandwidth stalls and compute-bound delays. In addition, metadata-aware optimizations reduce row/column access overhead by reusing contiguous address patterns within each bank. Evaluation on six recommendation datasets and three embedding dimensions demonstrates that TRAM achieves up to 2.8× speedup and 3.0× energy reduction compared to state-of-the-art heterogeneous memory systems, while preserving full compatibility with the standard DRAM interface. | - |
| dc.format.extent | 14 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | A Coalesced Tensor Reduction Architecture for Scalable All-Bank PIM Execution | - |
| dc.type | Article | - |
| dc.publisher.location | 미국 | - |
| dc.identifier.doi | 10.1109/JETCAS.2026.3657823 | - |
| dc.identifier.scopusid | 2-s2.0-105028890306 | - |
| dc.identifier.wosid | 001796293500018 | - |
| dc.identifier.bibliographicCitation | IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, v.16, no.2, pp 389 - 402 | - |
| dc.citation.title | IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS | - |
| dc.citation.volume | 16 | - |
| dc.citation.number | 2 | - |
| dc.citation.startPage | 389 | - |
| dc.citation.endPage | 402 | - |
| dc.type.docType | Article | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.subject.keywordPlus | Architecture | - |
| dc.subject.keywordPlus | Cost reduction | - |
| dc.subject.keywordPlus | Dynamic random access storage | - |
| dc.subject.keywordPlus | Embeddings | - |
| dc.subject.keywordPlus | Interface states | - |
| dc.subject.keywordPlus | Memory architecture | - |
| dc.subject.keywordPlus | Three dimensional integrated circuits | - |
| dc.subject.keywordAuthor | Vectors | - |
| dc.subject.keywordAuthor | Bandwidth | - |
| dc.subject.keywordAuthor | Computer architecture | - |
| dc.subject.keywordAuthor | Random access memory | - |
| dc.subject.keywordAuthor | Throughput | - |
| dc.subject.keywordAuthor | Circuits and systems | - |
| dc.subject.keywordAuthor | Tensors | - |
| dc.subject.keywordAuthor | Recommender systems | - |
| dc.subject.keywordAuthor | Memory architecture | - |
| dc.subject.keywordAuthor | Feature extraction | - |
| dc.subject.keywordAuthor | Recommendation system | - |
| dc.subject.keywordAuthor | 3D-stacked memory | - |
| dc.subject.keywordAuthor | processing-in-memory | - |
| dc.subject.keywordAuthor | all-bank mode | - |
| dc.subject.keywordAuthor | buffer die | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/11363574 | - |
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