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Reliability Evaluations of Pb-Free Solder Joint Formed Using Sn-Ag-Cu Solder Ball and Sn-Bi-Ag Solder Paste

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dc.contributor.authorKim, Jahyeon-
dc.contributor.authorIm, Taeyoon-
dc.contributor.authorLee, Sojeong-
dc.contributor.authorIm, Won Bin-
dc.contributor.authorKo, Yong-Ho-
dc.date.accessioned2026-07-20T03:00:14Z-
dc.date.available2026-07-20T03:00:14Z-
dc.date.issued2026-02-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/219353-
dc.description.abstractSn-3.0Ag-0.5Cu (SAC305) Pb-free solder has been widely used in electronic packaging for its excellent mechanical and electrical properties. However, its relatively high melting temperature (217° C) can induce substrate warpage and reliability during bonding processes. To solve this, low-temperature P b-free solders with S n - B i based lower bonding temperature have been gotten attentions. However, They have a fatal weakness with the brittleness of Bi which can degrade properties of solder joints. Therefore, we studied a combined solder joint with SAC305 solder ball and Sn-57Bi-1Ag solder paste using various bonding methods. We also researched joint properties, such as the Bi diffusion and intermetallic compound (IMC) thickness, and the shear strength during isothermal aging to improve solder joint reliability.-
dc.format.extent4-
dc.language영어-
dc.language.isoENG-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.titleReliability Evaluations of Pb-Free Solder Joint Formed Using Sn-Ag-Cu Solder Ball and Sn-Bi-Ag Solder Paste-
dc.typeArticle-
dc.publisher.location미국-
dc.identifier.doi10.1109/EPTC67330.2025.11392409-
dc.identifier.scopusid2-s2.0-105035391213-
dc.identifier.wosid001735114400134-
dc.identifier.bibliographicCitationProceedings of the 27th Electronics Packaging Technology Conference, EPTC 2025, pp 1 - 4-
dc.citation.titleProceedings of the 27th Electronics Packaging Technology Conference, EPTC 2025-
dc.citation.startPage1-
dc.citation.endPage4-
dc.type.docTypeConference paper-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryEngineering, Manufacturing-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusBinary alloys-
dc.subject.keywordPlusBismuth alloys-
dc.subject.keywordPlusBoron compounds-
dc.subject.keywordPlusChip scale packages-
dc.subject.keywordPlusLead alloys-
dc.subject.keywordPlusLead compounds-
dc.subject.keywordPlusLow temperature operations-
dc.subject.keywordPlusReliability-
dc.subject.keywordPlusSemiconducting intermetallics-
dc.subject.keywordPlusShear strength-
dc.subject.keywordPlusSilver alloys-
dc.subject.keywordPlusSoldered joints-
dc.subject.keywordPlusSoldering-
dc.subject.keywordPlusTemperature-
dc.subject.keywordPlusTin alloys-
dc.subject.keywordAuthorintermetallic compound-
dc.subject.keywordAuthorjoint property-
dc.subject.keywordAuthorPb-free solder-
dc.subject.keywordAuthorshear strength-
dc.subject.keywordAuthorSn-3.0Ag-0.5Cu (SAC305)-
dc.subject.keywordAuthorSn-57Bi-1Ag-
dc.subject.keywordAuthorSn-Bi-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/11392409-
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