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Reliability Evaluations of Pb-Free Solder Joint Formed Using Sn-Ag-Cu Solder Ball and Sn-Bi-Ag Solder Paste
- Authors
- Kim, Jahyeon; Im, Taeyoon; Lee, Sojeong; Im, Won Bin; Ko, Yong-Ho
- Issue Date
- Feb-2026
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- intermetallic compound; joint property; Pb-free solder; shear strength; Sn-3.0Ag-0.5Cu (SAC305); Sn-57Bi-1Ag; Sn-Bi
- Citation
- Proceedings of the 27th Electronics Packaging Technology Conference, EPTC 2025, pp 1 - 4
- Pages
- 4
- Indexed
- SCOPUS
- Journal Title
- Proceedings of the 27th Electronics Packaging Technology Conference, EPTC 2025
- Start Page
- 1
- End Page
- 4
- Abstract
- Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder has been widely used in electronic packaging for its excellent mechanical and electrical properties. However, its relatively high melting temperature (217° C) can induce substrate warpage and reliability during bonding processes. To solve this, low-temperature P b-free solders with S n - B i based lower bonding temperature have been gotten attentions. However, They have a fatal weakness with the brittleness of Bi which can degrade properties of solder joints. Therefore, we studied a combined solder joint with SAC305 solder ball and Sn-57Bi-1Ag solder paste using various bonding methods. We also researched joint properties, such as the Bi diffusion and intermetallic compound (IMC) thickness, and the shear strength during isothermal aging to improve solder joint reliability.
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Related Researcher
- Im, Won Bin
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)