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An advanced Fan-out Package Enhancing Die Position Accuracy and Warpage
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-02T16:01:46Z | - |
| dc.date.available | 2021-08-02T16:01:46Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2018-12-19 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/21999 | - |
| dc.publisher | Institute of Electrical and Electronics Engineers: Electronics Packaging Society | - |
| dc.title | An advanced Fan-out Package Enhancing Die Position Accuracy and Warpage | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | 2018 20th International Conference on Electronic Materials and Packaging | - |
| dc.relation.isPartOf | 2018 20th International Conference on Electronic Materials and Packaging | - |
| dc.citation.title | 2018 20th International Conference on Electronic Materials and Packaging | - |
| dc.citation.conferencePlace | The Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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