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An advanced Fan-out Package Enhancing Die Position Accuracy and Warpage
- Authors
- 김영호
- Issue Date
- 19-Dec-2018
- Publisher
- Institute of Electrical and Electronics Engineers: Electronics Packaging Society
- Citation
- 2018 20th International Conference on Electronic Materials and Packaging
- Conference Name
- 2018 20th International Conference on Electronic Materials and Packaging
- Place
- The Hong Kong University of Science & Technology, Clear Water Bay, Kowloon, Hong Kong
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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