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Rheology behavior and flash light sintering characteristics of Cu/Ag hybrid-ink for multi-layered flexible printed circuit board (FPCB) application in printed electronics
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김학성 | - |
| dc.date.accessioned | 2021-08-02T16:33:45Z | - |
| dc.date.available | 2021-08-02T16:33:45Z | - |
| dc.date.issued | 2018-12-04 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/22696 | - |
| dc.title | Rheology behavior and flash light sintering characteristics of Cu/Ag hybrid-ink for multi-layered flexible printed circuit board (FPCB) application in printed electronics | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | PacSurf 2018 | - |
| dc.citation.conferencePlace | 미국 하와이 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)