Microstructure and electrical properties of SiC dispersed molybdenum silicide composite
- Authors
- Byun, J. M.; Bang, S. -R.; Kim, S. H.; Kim, Young Do
- Issue Date
- Jun-2016
- Publisher
- TAYLOR & FRANCIS LTD
- Keywords
- Molybdenum silicide; Silicon carbide; Composite; Electrical resistance; Sintering
- Citation
- POWDER METALLURGY, v.59, no.3, pp.197 - 202
- Indexed
- SCIE
SCOPUS
- Journal Title
- POWDER METALLURGY
- Volume
- 59
- Number
- 3
- Start Page
- 197
- End Page
- 202
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/22991
- DOI
- 10.1080/00325899.2016.1142725
- ISSN
- 0032-5899
- Abstract
- In this study, a core–shell composite powder with Mo as the shell material and β-SiC as the core material was produced via chemical vapour transport caused by the hydrogen reduction of Mo oxide. Using this core–shell composite powder, a Mo silicide composite with uniformly dispersed β-SiC was fabricated by pressureless sintering at 1400°C. The relative density of specimens sintered for 10 hours was 96.1% and the electrical resistivity was 4.68 × 10⁻⁵ Ω m. It was concluded that a β-SiC dispersed molybdenum silicide composite with enhanced electrical resistivity was successfully fabricated at a relatively low sintering temperature using the core–shell composite powder.
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