Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nguyen Van Toan | - |
dc.contributor.author | Hahng, Shim | - |
dc.contributor.author | Song, Yunheub | - |
dc.contributor.author | Ono, Takahito | - |
dc.date.accessioned | 2021-08-02T16:53:37Z | - |
dc.date.available | 2021-08-02T16:53:37Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2016-05 | - |
dc.identifier.issn | 2072-666X | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/23116 | - |
dc.description.abstract | This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5 x 5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 mu m and sensing gap of 3.2 mu m (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | MDPI | - |
dc.title | Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducer Arrays Using Glass Reflow Process | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Song, Yunheub | - |
dc.identifier.doi | 10.3390/mi7050076 | - |
dc.identifier.scopusid | 2-s2.0-84971261463 | - |
dc.identifier.wosid | 000377983700004 | - |
dc.identifier.bibliographicCitation | MICROMACHINES, v.7, no.5, pp.1 - 9 | - |
dc.relation.isPartOf | MICROMACHINES | - |
dc.citation.title | MICROMACHINES | - |
dc.citation.volume | 7 | - |
dc.citation.number | 5 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 9 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | Y | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Analytical | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.subject.keywordPlus | Chemical bonds | - |
dc.subject.keywordPlus | Chemical sensors | - |
dc.subject.keywordPlus | Fabrication | - |
dc.subject.keywordPlus | Glass | - |
dc.subject.keywordPlus | Medical imaging | - |
dc.subject.keywordPlus | Natural frequencies | - |
dc.subject.keywordPlus | Q factor measurement | - |
dc.subject.keywordPlus | Silicon on insulator technology | - |
dc.subject.keywordPlus | Silicon wafers | - |
dc.subject.keywordPlus | Transducers | - |
dc.subject.keywordPlus | Ultrasonic testing | - |
dc.subject.keywordPlus | Ultrasonic transducers | - |
dc.subject.keywordPlus | Wafer bonding | - |
dc.subject.keywordAuthor | capacitive micromachined ultrasonic transducer | - |
dc.subject.keywordAuthor | glass reflow process | - |
dc.subject.keywordAuthor | anodic bonding | - |
dc.subject.keywordAuthor | medical imaging | - |
dc.subject.keywordAuthor | non-destructive measurement | - |
dc.subject.keywordAuthor | chemical sensing | - |
dc.identifier.url | https://www.mdpi.com/2072-666X/7/5/76 | - |
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