Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Effect of Ni-P microstructure on the interfacial IMC growth of ENIG/Sn-Ag-Cu
- Authors
- 김영호
- Issue Date
- 26-Oct-2018
- Publisher
- Korean Microelectronics and Packaging Society
- Citation
- 17th International Symposium on Microelectronics and Packaging 2018
- Conference Name
- 17th International Symposium on Microelectronics and Packaging 2018
- Place
- COEX, Seoul, Korea
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.