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복합광원 기반의 광 소결법을 이용한 구리나노잉크 패턴의 전도성 향상에 관한 연구

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dc.contributor.author황현준-
dc.contributor.author오경환-
dc.contributor.author김학성-
dc.date.accessioned2021-08-02T17:52:51Z-
dc.date.available2021-08-02T17:52:51Z-
dc.date.created2021-05-14-
dc.date.issued2015-11-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/24805-
dc.description.abstractWe developed an ultra-high speed photonic sintering method involving flash white light (FWL) combined with near infrared (NIR) and deep UV light irradiation to produce highly conductive copper nano-ink film. Flash white light irradiation energy and the power of NIR/deep UV were optimized to obtain high conductivity Cu films. Several microscopic and spectroscopic characterization techniques such as scanning electron microscopy (SEM) and a x-ray diffraction (XRD) were employed to characterize the Cu nano-films. Optimally sintered Cu nano-ink films produced using a deep UV-assisted flash white light sintering technique had the lowest resistivity (7.62 μΩ·cm), which was only 4.5-fold higher than that of bulk Cu film (1.68 μΩ•cm).-
dc.language한국어-
dc.language.isoko-
dc.publisher대한기계학회-
dc.title복합광원 기반의 광 소결법을 이용한 구리나노잉크 패턴의 전도성 향상에 관한 연구-
dc.title.alternativeEffective photonic sintering for highly conductive copper nano-ink film using flash white light combined with Deep UV and NIR light irradiation-
dc.typeArticle-
dc.contributor.affiliatedAuthor김학성-
dc.identifier.bibliographicCitation대한기계학회 창립 70주년 기념 학술대회, pp.571 - 575-
dc.relation.isPartOf대한기계학회 창립 70주년 기념 학술대회-
dc.citation.title대한기계학회 창립 70주년 기념 학술대회-
dc.citation.startPage571-
dc.citation.endPage575-
dc.type.rimsART-
dc.type.docTypeProceeding-
dc.description.journalClass3-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassother-
dc.subject.keywordAuthorCu nano-ink(구리 나노잉크)-
dc.subject.keywordAuthorSintering process(소결 공정)-
dc.subject.keywordAuthorFlash white light(극단파 백색광)-
dc.subject.keywordAuthorNear infrared(근 적외선)-
dc.subject.keywordAuthorDeep ultraviolet(원 자외선)-
dc.identifier.urlhttps://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE06575621-
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