Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards
DC Field | Value | Language |
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dc.contributor.author | Kim, Do-Hyoung | - |
dc.contributor.author | Joo, Sung-Jun | - |
dc.contributor.author | Kwak, Dong-Ok | - |
dc.contributor.author | Kim, Hak-Sung | - |
dc.date.accessioned | 2021-08-02T17:53:28Z | - |
dc.date.available | 2021-08-02T17:53:28Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2015-10 | - |
dc.identifier.issn | 0960-1317 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/24837 | - |
dc.description.abstract | In this study, the warpage simulation of a multi-layer printed circuit board (PCB) was performed as a function of various copper (Cu) patterns/photoimageable solder resist (PSR) composite patterns and their anisotropic viscoelastic properties. The thermo-mechanical properties of Cu/PSR patterns were obtained from finite element analysis (virtual test) and homogenized with anisotropic composite shell models that considered the viscoelastic properties. The multi-layer PCB model was simplified based on the unit Cu/PSR patterns and the warpage simulation during the reflow process was performed by using ABAQUS combined with a user-defined subroutine. From these results, it was demonstrated that the proposed anisotropic viscoelastic composite shell simulation technique can be successfully used to predict warpage of multi-layer PCBs during the reflow process. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.title | Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Hak-Sung | - |
dc.identifier.doi | 10.1088/0960-1317/25/10/105016 | - |
dc.identifier.scopusid | 2-s2.0-84947447699 | - |
dc.identifier.wosid | 000366827400032 | - |
dc.identifier.bibliographicCitation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.25, no.10, pp.1 - 12 | - |
dc.relation.isPartOf | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.title | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
dc.citation.volume | 25 | - |
dc.citation.number | 10 | - |
dc.citation.startPage | 1 | - |
dc.citation.endPage | 12 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Instruments & Instrumentation | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordAuthor | printed circuit board (PCB) | - |
dc.subject.keywordAuthor | warpage simulation | - |
dc.subject.keywordAuthor | viscoelastic property | - |
dc.subject.keywordAuthor | anisotropic shell model | - |
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