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Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, Sung-Hyeon | - |
| dc.contributor.author | Jang, Jin-Wook | - |
| dc.contributor.author | Kim, Hak-Sung | - |
| dc.date.accessioned | 2021-08-02T17:54:19Z | - |
| dc.date.available | 2021-08-02T17:54:19Z | - |
| dc.date.created | 2021-05-12 | - |
| dc.date.issued | 2015-09 | - |
| dc.identifier.issn | 0960-1317 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/24872 | - |
| dc.description.abstract | In this work, a terahertz time-domain spectroscopy (THz-TDS) imaging technique was used as a non-destructive inspection method for detecting voids in integrated circuit (IC) packages. Transmission and reflection modes, with an angle of incidence of 30 degrees, were used to detect voids in IC packages. The locations of the detected voids in the IC packages could be calculated by analyzing THz waveforms. Finally, voids that are positioned at the different interfaces in the IC package samples could be successfully detected and imaged. Therefore, this THz-TDS imaging technique is expected to be a promising technique for non-destructive evaluation of IC packages. | - |
| dc.language | 영어 | - |
| dc.language.iso | en | - |
| dc.publisher | IOP PUBLISHING LTD | - |
| dc.title | Non-destructive evaluation of the hidden voids in integrated circuit packages using terahertz time-domain spectroscopy | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Kim, Hak-Sung | - |
| dc.identifier.doi | 10.1088/0960-1317/25/9/095007 | - |
| dc.identifier.scopusid | 2-s2.0-84940398922 | - |
| dc.identifier.wosid | 000365167700014 | - |
| dc.identifier.bibliographicCitation | JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.25, no.9, pp.1 - 9 | - |
| dc.relation.isPartOf | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
| dc.citation.title | JOURNAL OF MICROMECHANICS AND MICROENGINEERING | - |
| dc.citation.volume | 25 | - |
| dc.citation.number | 9 | - |
| dc.citation.startPage | 1 | - |
| dc.citation.endPage | 9 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Article | - |
| dc.description.journalClass | 1 | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
| dc.relation.journalResearchArea | Instruments & Instrumentation | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
| dc.relation.journalWebOfScienceCategory | Instruments & Instrumentation | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | DEFECTS | - |
| dc.subject.keywordPlus | INSPECTION | - |
| dc.subject.keywordAuthor | non-destructive | - |
| dc.subject.keywordAuthor | terahertz | - |
| dc.subject.keywordAuthor | void | - |
| dc.subject.keywordAuthor | IC package | - |
| dc.subject.keywordAuthor | detection | - |
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)