Waterproof characteristics of nanoclay/epoxy nanocomposite in adhesively bonded joints

Abstract

When adhesively bonded joints are exposed to a moist environment, the tensile load capability of the joint is significantly decreased because moisture absorption weakens the mechanical properties of epoxy adhesive. In this paper, a nanoclay with excellent penetration resistance properties was used as a filler in epoxy adhesive in order to enhance adhesive strength in moist environments. The water absorption of the epoxy adhesive and the adhesive strength of the adhesively bonded joints were measured in water absorption experiments with respect to the weight fraction of the nanoclay and the moisture exposure time. These results showed that the tensile load capability of the nanoclay-filled adhesively bonded joint was greatly enhanced, even in a moist environment, because the nanoclay reduced water absorption into the epoxy adhesive as well as into the interface between the epoxy adhesive and the steel adherend and increased the strength of the epoxy adhesive itself.