Smart cure cycle to improve tensile load capability of the adhesively bonded joint

Abstract

Generally, the thermal residual stress which is generated during the curing process of an adhesive significantly decreases the tensile load capability of adhesively bonded joints. In this work, a smart cure cycle with abrupt cooling and postcuring at room temperature was devised to eliminate thermal residual stress and to produce sufficient interfacial wetting. For monitoring and controlling the curing reaction, dielectrometry was used, where the dissipation factor of the adhesive joint was measured. These results showed that the tensile load capability of the adhesively bonded joint fabricated by the smart cure cycle was greatly enhanced because the thermal residual stress was reduced, and sufficient interfacial wetting between the adhesive and adherend was achieved.